Why Study Metal Substrates for Thick-film Circuit Electric Heating-elements
Thick-film hybrid integrated circuits are circuit units with certain functions made on a ceramic substrate by printing, firing, soldering, mounting, and other processes of interconnecting wires, inductors, resistors, capacitors, semiconductor components, and chips. Because of the compact structure, stable contact, and reliable performance of this circuit element, it has been widely used in the fields of communications, automobiles, aviation, and home appliances.
In the past, the most used ceramic substrate was Al2O3, in addition to BeO, AlN, SiC, synthetic diamond and other ceramic substrates. Ceramic substrates have many advantages, such as good electromechanical properties, low dielectric loss, high insulation resistance, high mechanical strength, and good heat resistance. However, almost all ceramic substrates have insurmountable shortcomings:
①Brittleness, poor resistance to mechanical and thermal shock;
②The size of the substrate is limited, and the maximum area of the Al2O3 substrate is 100 mm×100 mm;
③The thermal conductivity of the ceramic substrate is insufficient to meet the heat dissipation needs of high-power density circuits;
④ Ceramic substrates are limited to flat-panel circuits.
Because of this, the innovation of substrate materials has become inevitable. Metal materials have long attracted people's attention for their good thermal conductivity and easy processing. JAYE has successfully developed a dielectric slurry for 430 stainless steel and developed an electric heating element with 430 stainless steel as a substrate. , Has been successfully applied in household appliances and other fields.
