In order to achieve higher precision, the most common processes are divided into three types:
1. Thick film printing process: high mesh rate screen is used. The wire diameter of this process will be thinner, the mesh number will be higher, the aperture ratio of the wire mesh will be higher, and the thin wire will not be easily broken.
2. Thick film lithography process: through lithography or photolithography technology. First sintered to form a film, and then photoetched into a pattern. The materials usually include organic silver paste, thin printed silver, and glass-free conductors. After developing, it can be directly formed into a pattern, which saves the printing cost. The photoresist step can improve the precision of the wires. Thick-film lithography is this process, and it is also the high-precision thick-film sintering process technology that is actually mass-produced.
3. Thick film direct drawing technology: This technology is mainly designed on CAD, and then directly draws thick film patterns on the substrate without plate making and screen making. The line width and spacing of wiring under this process can be precisely controlled, suitable for small batches Multi-variety production
