Screen printing is to use a scraper to brush the conductive paste, resistance paste and dielectric paste through the mesh plate or metal plate with circuit graphics, so as to form the required circuit, resistance and capacitance graphics on the surface of ceramic substrate, and then through sintering or polymerization to complete the adhesion between the film and the substrate. Sintering technology also includes the manufacture of ceramic substrates.
Screen printing is the most commonly used printing in thick film. First, a net made of silk, nylon or stainless steel wire is stretched on the frame, and then the organic film or metal foil (called mask) engraved with conductor or resistance pattern is pasted on the screen. In printing, the substrate is placed under the screen, and the slurry is placed on the screen. Then, the scraper made of rubber or plastic moves on the screen at a certain speed and pressure, so that it can be missed printed on the substrate through the opening pattern on the mask, so that the desired pattern of the paste can be obtained on the substrate.
Sintering, also known as sintering, is one of the main processes in thick film technology. The printed thick film paste has certain electrical properties only after sintering process, so it can become the required thick film components. The sintering process includes three stages: heating up, holding and cooling of the highest sintering temperature (or peak temperature).